Ultrasonic frequency: 130 kHz
Flying bondhead
Fixed electrode (EFO currents upto 400 mA)
Bond placement accuracy: ± 2.5 µm (3 sigma)
Sprint UPH: 17 wires/second (UPH depends on material/ process requirements)
Maximum bonding area: 52 mm x 70 mm (2″ x 2.7″)
Process zone temperature: ambient to 300°C
Various looping profiles maximum loop length of 9 mm
Application
Gold and copper wire (17.5 µm–50µm diameter) ball-wedge bonding
There are no reviews yet.