Orthodyne M360C Heavy Wire Bonder
Year 1996
CSI Semiconductor Solutions Ltd
Bond Type: Ultrasonic Wedge
Wire Size and Type: 4 to 20 mils (100 to 500 microns) aluminum. (4 mil (100 micron) wire with front cut only). Also 25 mil (625 micron) can be used with an optional kit – not included. Small wire kit can sold with this if required.
Wire Bond Area: 250 mm x 150 mm (10? x 6?)
Maximum Wires per Device: approximately 1 500 two-bond wires
Bond Angle: ±45° from loop direction. Dependent on loop height.
Bond Head Rotation: ±200°
X-Y Resolution: 0.12 mil (3.125 microns)
As is Where is Sale.
Features:
Bonds to almost any electronic package requiring 100-500 micron (4-20 mil) wire.
Orthodyne gray-scale pattern recognition system gives higher yield and throughput rates.
Enhanced process control features can be individually modified for each bond.
Four-axis head allows bonding in any direction to any type of module leadframe or hybrid substrate.
Low maintenance bond head with no pivot bearing or solenoids to bind or wear.
Shaft encoders on all four motion axes for a completely closed-loop positioning system.
Small footprint and removable work platform for easy handler integration.
Programmable bonding parameters for each bond produce better bond quality and reliability.
There are no reviews yet.